{"id":84,"date":"2019-01-18T15:35:44","date_gmt":"2019-01-18T07:35:44","guid":{"rendered":"https:\/\/www.bihec.com\/idonus\/?p=84"},"modified":"2019-09-21T10:08:08","modified_gmt":"2019-09-21T02:08:08","slug":"%e7%91%9e%e5%a3%abidonus%e6%99%b6%e5%9c%86%e9%94%ae%e5%90%88%e6%a3%80%e6%b5%8b%e6%9c%ba","status":"publish","type":"post","link":"https:\/\/www.bihec.com\/idonus\/%e7%91%9e%e5%a3%abidonus%e6%99%b6%e5%9c%86%e9%94%ae%e5%90%88%e6%a3%80%e6%b5%8b%e6%9c%ba\/","title":{"rendered":"\u745e\u58ebIdonus\u6676\u5706\u952e\u5408\u68c0\u6d4b\u673a"},"content":{"rendered":"
Wafer bonding inspection device
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Wafer bonding inspection device [pdfjs-viewer url=”https:\/\/www.bihec.com\/idonus\/wp-c <\/p>\n","protected":false},"author":14,"featured_media":96,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[3],"tags":[7,13,45,14,15,44,43],"yoast_head":"\n