With twice the cleaning rate as the Expanded Plasma Cleaner, the High Power Expanded Plasma Cleaner is a versatile instrument, suitable for etching organic thin films (10-100 nm) as well as surface activation and modification. 

Features

PDC-001-HP (115V); PDC-002-HP (230V)

Larger, tabletop unit 

Adjustable RF power (Low, Medium, and High power settings)

Applies a maximum of 45W to the RF coil

Low RF power setting is equivalent to High RF power setting on PDC-001/PDC-002

Includes a 6" diameter x 6.5" length Pyrex chamber

Hinged door with viewing window

Active fan cooling

Integral switch for a vacuum pump

1/8" NPT metering valve to qualitatively control gas flow and chamber pressure 

1/8" NPT 3-way valve to quickly switch from bleeding in gas, isolating the chamber, and venting 

Weight: 37 lbs 

Size: 11" H x 18" W x 9" D

Optional PlasmaFlo gas mixer allows quantitative control of up to two (2) process gases and monitoring of chamber pressure

Optional quartz chamber and sample tray

Compatible vacuum pump available

Requirements

Our Plasma Cleaners require a vacuum pump with a minimum pump speed of 1.4 m3/hr (0.83 ft3/min) and an ultimate total pressure of 200 mTorr (0.27 mbar) or less

For pumping nonreactive gases (air, N2, Ar), see our Standard Vacuum Pumps.

For pumping concentrated or pure oxygen gas, see our Oxygen Service Pumps.