丹麥tantec公司介紹
我們有超過40年的歷史，任何行業(yè)的高端表面處理產(chǎn)品的制造經(jīng)驗(yàn)。Tantec不斷為苛刻的實(shí)驗(yàn)要求開發(fā)新的解決方案。
Tantec集團(tuán)是一家私人控股公司，成立于1974年,是一家主要為塑料和金屬表面提高附著力而生產(chǎn)標(biāo)準(zhǔn)和定制的等離子體和電暈系統(tǒng)的公司。Tantec表面處理系統(tǒng)擁有全世界最多的客戶超過30個(gè)全球合作伙伴.
Tantec / S是總部位于丹麥的Lunderskov,purpose-build工廠從1989年開始,服務(wù),研發(fā)專用機(jī)械和高質(zhì)量的電子表面處理設(shè)備。
Tantec EST inc .)是北美分公司，成立于1987年,在芝加哥。
Wimsheim Tantec GmbH,在漢堡,以及生產(chǎn)設(shè)備銷售和服務(wù)辦事處，1995年在德國成立。
產(chǎn)品介紹：
Roto VAC真空等離子處理器是專為小型注塑塑料部件設(shè)計(jì)的，不用把他們放在夾具中或者其他復(fù)雜的控制工具。
獨(dú)特的鼓式設(shè)計(jì)，只需要將樣品放在里面填滿，然后儀器的旋轉(zhuǎn)會確保所有的部件表面都會被處理到。
當(dāng)真空度達(dá)到1~4mbar時(shí)，真空室中電極會通過等離子體電極放電，處理周期非常短，一般為20~180秒，不同材料和配方時(shí)間不同。
| FEATURES: | |
| Easy to install and use | Connect to mains power and compressed air. |
| Fast treatment times | High power impact enables treatment times from 20-180 seconds, depending on material. |
| Standard or customised chambers | Chamber and drum size can be designed to most applications. Many available as standard. |
| Vacuum level | The plasma discharge is active from 1-4 mbar depending on application. |
| Process gas | Process gasses such as oxygen and argon can be used, but in mostcases it is not necessary. |
| Process control | The entire plasma process is controlled by the HV-X generator and PLC unit. All parameters are displayed through the touch panel. (Standard – Proface). |
| Cost efficient surface treatment | Due to the low power and no need of special treatment gasses the unit is a very cost efficient solution for improving surface wettability and adhesion. |
| Vacuum pressure plasma | Enables treatment of both conductive and non-conductive surfaces. |
| Technical Specifications | RotoVAC Vacuum Plasma Treater |
| Mains voltage and frequency | 230 VAC or 480 VAC 3Ph. |
| Output voltage/plasma power | Max. 400 Vp/max. 2000 Watt |
| Power supply | HV-X plasma generator series |
| Compressed air inlet | 5–6 bar dry and clean |
| Process gas | Standard: air, oxygen, argon, nitrogen on request |
| Vacuum pump capacity in m³/min. | 15 to 240 m³/min., depending on size of vacuum chamber |
| Vacuum level | 1–4 mbar |
| Evacuation time, typical | 15-60 seconds, depending on chamber size and pump capacity |
| Plasma treatment time, typical | 20–180 seconds, depending on material |
| Control and connectivity | Complete with touch panel. (Standard – Proface) |
| Regulation compliance | CE – RoHs – WEEE |