現代電子產品的消水平更的功率比以往任何時候。 傳統的板級互常常易安培的電板空用以提或增加在PCB的線或板的厚度。 其他增加入電源電纜電線的數。 安畢業后一™提供了一個力的水平向事會方法。
特點與優勢
· RADSOK ?產品最委員會的權力
·事會的權力在小型
·在兩種尺寸內置3.6mm70A條和5.7毫米120A條可用
·先的電力備正交卡
·消由紋緊固件板開潛力
畢業后一是°功率散均勻
·無特殊壓接工具。 畢業后一™加回流焊工
·標準壓接或專用管
·徑向孔確保多點的接和效的熱Disspation
·電氣業務域標準
Modern electronics are consuming higher power levels than ever before. Conventional Board level interconnects often trade board space for higher amperage or increase the thicknesses of copper traces in the PCB or backplane. Other options increase the quantity of the wires in the incoming power cable. Amphenol’s PGY™ provides a method of bringing power horizontally to the board.
Features & Benefits
· RADSOK® Highest Power to Board Product
· High Power to Board in a Small Footprint
· Available in two Sizes, 3.6mm (70A) and 5.7mm (120A)
· Orthogonal Card Edge Power Device
· Eliminates Potential of Cracking Boards from Threaded Fasteners
· Legs of PGY Dissipate High Power Evenly
· No Special Crimp Tools Needed. PGY™ Legs Attach Through a Solder Reflow Process
· Standard Crimp or Application Specific Pins Available
· Radial Socket Design Ensures Multiple Points of Contact and Efficient Heat Disspation
· Silver Plated Electrical Engagement Area Standard
| Applications | Circular / Cylindrical Connectors; Military Connector; High Amp Power Connector |
| Connector Type | Power Connector |
| Gender | Male; Female |
| Termination Types | Crimp (optional feature); Busbar Mount |
| Contacts | |
| Number of Contacts | 1 to 59 |
| Features | Environment Resistant |
| RoHS Compliant | RoHS |
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