密度系方式0.070“× 0.060”格
- 40接
- 80接
- 120接
- 160接
HDB3 Connector
- High density contact pattern: .070” x .060” grid spacing
- Low mated height: .500 from mother board to row A of daughter board
- Utilizes the high performance brush contact system for reliability in harsh environments
- Mounting hardware, keys and guide pins have been combined to occupy less board space
- Available in the following contact arrangements
- 40 contacts
- 80 contacts
- 120 contact
- 160 contacts
- Configurable for data rates up to 3.125 Gbps data rates per differential pair
- RoHS compliant version available
技術參數/Specifications
| Termination Types | Solder; Crimp |
| Geometry | Straight (optional feature); RightAngle (optional feature) |
| Gender | Male; Female |
| Mounting | PC Mount |
| Performance | |
| Current Rating | 2 amps |
| Contact Resistance | 20 milliohms |
| Insulation Resistance | 5000 Mohms |
| Number of Contacts | 40 to 160 |
| Operating Temperature | -65 to 125 C |
| RoHS Compliance | RoHS |
HDB3的接器,安天工業總公司,小D型接器,HDB3 Connector, Amphenol Aerospace Corporation, D-subminiature Connectors
