SMASH Backplane connector / parallel / SMT / high-density 0.075 x 0.75 in

Backplane connector / parallel / SMT / high-density 0.075 x 0.75 in | SMASH 背板連接器/并行/ SMT /高密度0.075×0.75 |粉碎
Backplane connector / parallel / SMT / high-density 0.075 x 0.75 in | SMASH 背板連接器/并行/ SMT /高密度0.075×0.75 |粉碎

Characteristics
特點
Type:
類型：
backplane
背板
Shape:
形狀：
parallel
并行
Connection type:
連接類型：
SMT
SMT
Electrical characteristics:
電氣特性：
high-density
高密度
Description
描述
The SMASH offers high robustness where signal integrity is required.
該粉碎提供高魯棒性的信號完整性是必需的。
Based on an aluminium shell with 1, 2 or 3 bays, the SMASH can house up to 450 contacts. The chevron grid pattern (1.905 x 1.905 [.075 x .75]) provides high contact density for advanced electronics packaging. The shell is equipped with grounding, guide pins, and keying devices to ensure mechanical reliability.
基于鋁殼的1，2或3個海灣，粉碎可以容納450個觸點。所提出的網格模式（1.905×075×75×1.905）為先進的電子封裝提供高接觸密度。外殼配有接地、導向管腳和鍵控裝置，以確保機械可靠性。

Backplane connector / parallel / SMT / high-density 0.075 x 0.75 in | SMASH 背板連接器/并行/ SMT /高密度0.075×0.75 |粉碎


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