Beam Imaging BOS-18型光束觀察系統(tǒng)

在標準形式下,BOS-18型光束觀察系統(tǒng)有一個直徑為18毫米的活動區(qū)域MCP和P-43熒光屏組件,安裝在一個帶玻璃視窗的2.75英寸(70毫米)conflat法蘭內。磷屏和MCP的電氣連接是通過MHV引線實現的。

產品概述

在標準形式下,BOS-18型光束觀察系統(tǒng)有一個直徑為18毫米的活動區(qū)域MCP和P-43熒光屏組件,安裝在一個帶玻璃視窗的2.75英寸(70毫米)conflat法蘭內。磷屏和MCP的電氣連接是通過MHV引線實現的。

可選配置在產品選項卡中詳細討論,包括雙MCP板(人字形)SHV饋通光纖窗口和CCD攝像機系統(tǒng)

Imaging Area18mm Diameter
MCP (Standard)0.975″ Diam. (BOS-18), 10 micron channel diameter, Imaging Grade, 18mm active area, 12 micron pitch, 5° Bias Angle, 40:1 Aspect Ratio (Standard, BOS-18), Max. Gain: 2 x 104 (single plate, Std.) 1000V > 107 (chevron, OPT-01), 2000V
Phosphor Screen (Standard)P-43 with aluminum overcoat. P-43 Peak Wavelength: λ= 545 nm.
Power Supply Requirements0 – + 1000V, 1mA single MCP (Standard), 0 – + 2000V, 1mA dual MCP (OPT-01), 0 – + 5000V, 1 mA Phosphor Screen
Beam Energy Range1 eV to over 50 keV
Beam Current Range< 10 μA (with optional beam attenuation grids)
Vacuum1 x 10-6 Torr or better required to operate MCP, UHV compatible, maximum bakeout temperature 300 C
Welded Glass Windows (Standard)A non-removable glass window that is welded to the flange is standard. This allows bakeout temperatures > 200C.

MCP/熒光屏組件可以安裝在離真空密封表面或BOS窗口特定距離的延伸平臺上。該距離由客戶指定(注意:下圖顯示的是型號BOS-40,但帶有擴展平臺的型號BOS-18看起來類似)。


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