Epoxy Adhesive & Potting Compound — 10-3009

Epoxy Adhesive & Potting Compound -- 10-3009 Epoxies Etc...

10-3009是一種低粘度環氧樹粘劑和灌封料。 它易于使用并允最終用戶整固化環氧樹的靈活性。 產品提供了剝離和拉伸強度的好結合。 10-3009提供電氣絕緣性和出的著力。

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion.

技術參數/Specifications

Electrical 
Dielectric Strength 2.17E7
Dielectric Constant 3.11
Form Adhesives; Potting Compound
Material Thermoset or RTV; Two Component or Catalyst Cured; Epoxy
Features Electronics / Semiconductors

環氧粘劑及密封劑-10-3009,環氧樹等。,電氣絕緣性和介電材料,Epoxy Adhesive & Potting Compound , 10-3009, Epoxies Etc…, Electrical Insulation and Dielectric Materials


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