單組份熱固化環(huán)氧樹體系。 是一種快固化材料的低溫固化和優(yōu)的著力名。
One Component Epoxy Adhesive — 10-3793
One component heat cure epoxy system. This is a fast curing material known for its low temperature cure and excellent adhesion.
技術(shù)參數(shù)/Specifications
| Form / Function | Die Bonding Adhesives; Liquid |
| Material System | |
| Chemical System | Epoxy |
| Composition | Unfilled |
| Cure / Technology | Thermoset; Single Component |
| Composition & Features | |
| Industry | Electronics; OEM or Industrial |
單組分環(huán)氧粘劑-10-3793,環(huán)氧樹等..,密封劑,灌封化合物,One Component Epoxy Adhesive , 10-3793, Epoxies Etc…, Encapsulants and Potting Compounds