10-3170是一種單組分熱固化環氧體系。 不像多環氧體系的一分是可以治愈10-3170在度的低溫。 由于它夠在低溫下固化系統可應用在溫度的地方固化系統是禁止的各種應用。
One Component Epoxy — 10-3170
10-3170 is a one component heat curing epoxy system. Unlike many one part epoxy systems, 10-3170 can be cured at moderately low temperatures. Due to its ability to cure at low temperatures, this system can be utilized in numerous applications where higher temperature curing systems were prohibited.
技術參數/Specifications
| Type | High Dielectric |
| Form / Function | Die Bonding Adhesives; Gap Filler, Foam in Place Gasket; Liquid |
| Material System | |
| Chemical System | Epoxy |
| Composition | Unfilled |
| Cure / Technology | Thermoset; Single Component |
| Composition & Features | |
| Industry | Electronics; OEM or Industrial |
單組分環氧-10-3170,環氧樹等..,密封和灌封化合物,One Component Epoxy , 10-3170, Epoxies Etc…, Encapsulants and Potting Compounds