20-3061是100反應性環氧樹體系不含有任何溶劑或添加劑級的物理熱和電氣絕緣性。 是一個充滿低粘度系統提供好的流動性和浸潤的特點。 20-3061是專為灌封澆并結合應用。
Epoxy Resin System — 20-3061
20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed for potting, casting, and bonding applications.
技術參數/Specifications
| Electrical | |
| Dielectric Constant | 4.20 |
| Form | Potting Compound |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
環氧樹體系-20-3061,環氧樹等..,電氣絕緣材料和絕緣材料,Epoxy Resin System , 20-3061, Epoxies Etc…, Electrical Insulation and Dielectric Materials