20-3205是一個兩分常溫固化環氧體系。 它提供了一個低混合粘度和優的電絕緣性。
Epoxy Potting Compound — 20-3205
20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties.
技術參數/Specifications
| Electrical | |
| Dielectric Strength | 1.79E7 |
| Dielectric Constant | 4.30 |
| Form | Potting Compound |
| Material | Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
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