20-3030是一個空缺低粘度環氧樹體系。 系統是專為快流平和易用性。 20-3030有一個方便的2:1的比例混合并在室溫下固化。 是一個化學品水和性很好的擇。 20-3030具有優的粘接屬塑料涂層的導線。
Epoxy Potting and Casting Resin — 20-3030
20-3030 is an unfilled, low viscosity epoxy system. This system was designed for fast, self leveling and ease of use. 20-3030 has a convenient 2:1 mix ratio and will cure at room temperature. It is a good choice for chemical, water and corrosion resistance. 20-3030 also exhibits excellent adhesion to metals, plastic, and coated lead wires.
技術參數/Specifications
| Material Form | Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
環氧樹灌封和樹-20-3030,環氧樹等。,電氣樹和電子化合物,Epoxy Potting and Casting Resin , 20-3030, Epoxies Etc…, Electrical Resins and Electronic Compounds