環氧樹等的樹用于保護離并瞞電元件和備。 些方旨在滿灌封多刻的求封并投在電子電器汽和空天等業應用。
Low Density Rigid Polyurethane Foam — 20-2023
Epoxies, Etc’s resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries.
技術參數/Specifications
| Type | ClosedCell; Rigid; Foam |
| Form / Shape | Casting Resin |
| Material / Composition | Polymer / Plastic; Elastomer; Polyurethane |
| Material Properties | |
| Density | 2.20 lbs/ft3 |
| Applications | Industrial OEM; Potting; Encapsulating |
| Features & Approvals | Electrical Insulation; Flame or Fire Retardant; Thermal Insulation; UL; UL 94 V-1;0 |
低密度硬氨泡沫-20-2023,環氧樹等..,泡沫和泡沫材料,Low Density Rigid Polyurethane Foam , 20-2023, Epoxies Etc…, Foams and Foam Materials