40-3904是一種二組分方在室溫下固化。 它也可以很快治愈度發熱。 40-3904已為便于應用水平低的離子優的導電性低出毒氣變性。 它也以其出的化學性。
40-3904是一種二組分方在室溫下固化。 它也可以很快治愈度發熱。 40-3904已為便于應用水平低的離子優的導電性低出毒氣變性。 它也以其出的化學性。
40-3904 is a two component formulation designed to cure at room temperature. It may also be quickly cured with mild heat. The 40-3904 has low levels of ions, excellent electrical conductivity, low out gassing, and high thixotropy for ease of application. It is also known for its outstanding chemical resistance.
Compound Type | Electrically Conductive Compound |
Material Form | Die Bonding Adhesives; Liquid |
Industry | Electronics (PCB / SMT Assembly) |
Chemical System | Epoxy |
Filler | Unfilled Resin, Base Polymer or Neat Resin |
微電子級環氧樹-40-3904,環氧樹等..,電氣樹和電子化合物,Microelectronic Grade Epoxy , 40-3904, Epoxies Etc…, Electrical Resins and Electronic Compounds