40-3915是一個新的單組分100固體填充環氧樹粘劑。 個系統以滿半導體業的嚴格求。 40-3915是多才多的可以在低溫或溫下固化單元治愈。 它不含有任何溶劑和100度后的離子雜含極低。
One Component Silver Filled Epoxy — 40-3915
40-3915 is a new single component, 100% solids, silver filled epoxy adhesive. This system was engineered to meet the stringent requirements of the semiconductor industry. 40-3915 is versatile and can be cured at low temperatures or snap cured at elevated temperatures. It does not have any solvents and contains extremely low levels of ionic impurities after 100oC.
技術參數/Specifications
| Compound Type | Electrically Conductive Compound |
| Material Form | Die Bonding Adhesives; Liquid |
| Industry | Electronics (PCB / SMT Assembly); OEM / Industrial |
| Chemical System | Epoxy |
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