50-3121是一個充滿單組分熱傳導(dǎo)性電氣絕緣環(huán)氧樹系統(tǒng)。 種材料的變和SMD的印刷電板或其他基板波峰焊前放置。
Single Component Thermally Conductive — 50-3121
50-3121 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD’s on printed circuit boards or other substrates prior to wave soldering.
技術(shù)參數(shù)/Specifications
| Form | Adhesives; Gel, Paste, or Grease |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Epoxy |
| Features | Electronics / Semiconductors |
單組分導(dǎo)熱-50-3121,環(huán)氧樹等..,電氣絕緣和絕緣材料,Single Component Thermally Conductive , 50-3121, Epoxies Etc…, Electrical Insulation and Dielectric Materials