50-3130是一種單組分填充環(huán)氧粘合劑。 它提供了出的著力和優(yōu)的熱傳導(dǎo)性。 50-3130利用了提供快傳熱和優(yōu)的電氣絕緣專用填料混合。 50-3130是用于粘接屬和瓷的散熱。
Single Component Thermally Conductive — 50-3130
50-3130 is a one component, highly filled, epoxy adhesive. It provides outstanding adhesion and excellent thermal conductivity. 50-3130 utilizes a blend of proprietary fillers that provide fast heat transfer and excellent electrical insulation. 50-3130 is designed for bonding metals and ceramics for heat dissipation.
技術(shù)參數(shù)/Specifications
| Electrical | |
| Dielectric Strength | 1.77E7 |
| Dielectric Constant | 5.40 |
| Form | Adhesives; Gel, Paste, or Grease |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Epoxy |
| Features | Electronics / Semiconductors |
單組分導(dǎo)熱-50-3130,環(huán)氧樹等..,電氣絕緣和絕緣材料,Single Component Thermally Conductive , 50-3130, Epoxies Etc…, Electrical Insulation and Dielectric Materials