50-3185是一個填充環(huán)氧密封劑具有優(yōu)異的物理電氣和熱性。 50-3185是一個很好的擇在低的熱優(yōu)異的電氣絕緣和/或?qū)嵝允潜氐摹?三種催化劑可供擇。
Thermally Conductive Resin — 50-3185 Catalyst #140
50-3185 is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from.
技術(shù)參數(shù)/Specifications
| Electrical | |
| Dielectric Strength | 1.50E7 |
| Dielectric Constant | 5.41 |
| Form | Potting Compound |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
導(dǎo)熱樹-50-3185催化劑140,環(huán)氧樹等..,電氣絕緣材料和絕緣材料,Thermally Conductive Resin , 50-3185 Catalyst #140, Epoxies Etc…, Electrical Insulation and Dielectric Materials