50-3120是一個充滿單組分熱傳導(dǎo)性電氣絕緣環(huán)氧樹系統(tǒng)。 種材料的變和SMD的印刷電板或其他基板波峰焊前放置。 它也可以用在散熱器的應(yīng)用。
50-3120是一個充滿單組分熱傳導(dǎo)性電氣絕緣環(huán)氧樹系統(tǒng)。 種材料的變和SMD的印刷電板或其他基板波峰焊前放置。 它也可以用在散熱器的應(yīng)用。
50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD’s on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.
Compound Type | Thermally Conductive |
Material Form | Die Bonding Adhesives; Liquid |
Industry | Electronics (PCB / SMT Assembly) |
Chemical System | Epoxy |
單組分導(dǎo)熱-50-3120,環(huán)氧樹等..,電氣樹和電子化合物,Single Component Thermally Conductive , 50-3120, Epoxies Etc…, Electrical Resins and Electronic Compounds