50-2366 FR是一種新的熱傳導性氨灌封料。 種靈活的系統是專為低應力敏感元件中后治愈。 50-2366燃氨樹體系制定用于低放熱低收縮率優異的電性和應用。
Thermally Conductive PU Potting Compound — 50-2366 FR
50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties.
技術參數/Specifications
| Type | Thermally Conductive |
| Form / Function | Liquid |
| Material System | |
| Chemical System | Elastomeric; Polyurethane |
| Composition | Filled |
| Cure / Technology | Thermoset; Two Component ; Room Temperature Vulcanizing or Curing |
| Composition & Features | |
| Features | Flame Retardant; UL Rating |
| Industry | Electronics |
導熱PU灌封料-50-2366燃,環氧樹等。,密封劑,灌封化合物,Thermally Conductive PU Potting Compound , 50-2366 FR, Epoxies Etc…, Encapsulants and Potting Compounds