環氧樹等的樹用于保護離并瞞電元件和備。 些方旨在滿灌封多刻的求封并投在電子電器汽和空天等業應用。
Epoxy Potting and Encapsulating Compound — 20-3211
Epoxies, Etc’s resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries.
技術參數/Specifications
| Electrical | |
| Dielectric Strength | 1.81E7 |
| Dielectric Constant | 4.30 |
| Form | Potting Compound |
| Material | Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
環氧樹灌封和封化合物-20-3211,環氧樹等..,電氣絕緣材料和絕緣材料,Epoxy Potting and Encapsulating Compound , 20-3211, Epoxies Etc…, Electrical Insulation and Dielectric Materials