20-3650是一個易于使用的一對一的比例電子級環氧樹灌封澆和封系統。 系統具有優的物理熱和電氣絕緣性。 20-3650是DOT危容易混合并在室溫下固化或度發熱。
Epoxy Potting and Encapsulating Compound — 20-3650
20-3650 is an easy to use, one to one ratio, electronic grade epoxy potting, casting, and encapsulating system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3650 is D.O.T. non-hazardous, easy to mix, and will cure at room temperature or with mild heat.
技術參數/Specifications
| Electrical | |
| Dielectric Strength | 1.81E7 |
| Dielectric Constant | 4.30 |
| Form | Potting Compound |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
環氧樹灌封和封化合物-20-3650,環氧樹等..,電氣絕緣材料和絕緣材料,Epoxy Potting and Encapsulating Compound , 20-3650, Epoxies Etc…, Electrical Insulation and Dielectric Materials