環(huán)氧樹等的樹用于保護離并瞞電元件和備。 些方旨在滿灌封多刻的求封并投在電子電器汽和空天等業(yè)應(yīng)用。
Epoxy Potting and Encapsulating Resin — 20-3041
Epoxies, Etc’s resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries.
技術(shù)參數(shù)/Specifications
| Material Form | Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly) |
| Chemical System | Epoxy |
| Filler | Unfilled Resin, Base Polymer or Neat Resin |
環(huán)氧樹灌封和封樹-20-3041,環(huán)氧樹等..,電氣樹和電子化合物,Epoxy Potting and Encapsulating Resin , 20-3041, Epoxies Etc…, Electrical Resins and Electronic Compounds