20-3042是一個用的剛性環氧樹密封為便于處理。 種低粘度系統具有優的物理熱和電氣絕緣性。
Epoxy Potting and Encapsulating Resin — 20-3042
20-3042 is a general purpose rigid epoxy encapsulant designed for ease in handling. This low viscosity system exhibits excellent physical, thermal, and electrical insulation properties.
技術參數/Specifications
| Electrical | |
| Dielectric Strength | 1.81E7 |
| Dielectric Constant | 4.10 |
| Form | Potting Compound |
| Material | Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
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