20-3651是一個填充環氧樹澆注灌封和封樹體系。 系統具有優的物理熱和電氣絕緣性。 20-3651很容易加工和展優秀的著力對屬瓷和塑料。
Epoxy Resin — 20-3651
20-3651 is a filled epoxy casting, potting, and encapsulating resin system. This system exhibits excellent physical, thermal, and electrical insulation properties. 20-3651 is easily machined and exhibits outstanding adhesion to metals, ceramics, and plastics.
技術參數/Specifications
| Electrical | |
| Dielectric Strength | 1.77E7 |
| Dielectric Constant | 4.80 |
| Form | Potting Compound |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
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