20-3061是100反應(yīng)性環(huán)氧樹體系不含有任何溶劑或添加劑級的物理熱和電氣絕緣性。 是一個充滿低粘度系統(tǒng)提供好的流動性和浸潤的特點。 20-3061是專為灌封澆并結(jié)合應(yīng)用。
Epoxy Resin System — 20-3061
20-3061 is a 100% reactive epoxy resin system which does not contain any solvents or additives which downgrade physical, thermal, and electrical insulation properties. This is a filled low viscosity system which provides good flow and wet out characteristics. 20-3061 is designed for potting, casting, and bonding applications.
技術(shù)參數(shù)/Specifications
| Electrical | |
| Dielectric Constant | 4.20 |
| Form | Potting Compound |
| Material | Filled Resin or Composite Material; Thermoset or RTV; Two Component or Catalyst Cured; Epoxy |
| Features | Electronics / Semiconductors |
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