50-2370是一種新的熱傳導(dǎo)性氨灌封料。 系統(tǒng)是專(zhuān)為低應(yīng)力敏感元件中后治愈。 它是制定了求低放熱低收縮率優(yōu)異的電性和快5分凝時(shí)的應(yīng)用程序。
50-2370 is a new thermally conductive polyurethane potting compound. This system is designed for low stress on sensitive components during and after cure. It is formulated for applications requiring low exotherm, low shrinkage, excellent electrical properties and a rapid 5 minute gel time.
技術(shù)參數(shù)/Specifications
| Compound Type | Thermally Conductive |
| Material Form | Encapsulant, Potting Compound; Liquid |
| Industry | Electronics (PCB / SMT Assembly); OEM / Industrial; Semiconductors or Semiconductor Packaging; Surface Mount Components |
| Features | Flame Retardant or UL 94V-0 Rated |
| Chemical System | Polyurethane |
快的凝氨復(fù)合-50-2370,環(huán)氧樹(shù)等..,電氣樹(shù)和電子化合物,Fast Gelling Polyurethane Compound , 50-2370, Epoxies Etc…, Electrical Resins and Electronic Compounds