50-3186是一個兩分導熱環氧粘合劑。 變溫債券提供的各種基材。 50-3186是一個導熱低工作溫度性應用的理想擇。
50-3186是一個兩分導熱環氧粘合劑。 變溫債券提供的各種基材。 50-3186是一個導熱低工作溫度性應用的理想擇。
50-3186 is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance.
Compound Type | Thermally Conductive |
Material Form | Die Bonding Adhesives; Liquid |
Industry | Electronics (PCB / SMT Assembly) |
Chemical System | Epoxy |
Filler | Unfilled Resin, Base Polymer or Neat Resin |
溫環氧-50-3186,環氧樹等..,電氣樹和電子化合物,High Temperature Resistant Epoxy , 50-3186, Epoxies Etc…, Electrical Resins and Electronic Compounds