50-3115是其中的一分導熱電絕緣環氧樹。 環氧樹系統的和求電子粘接應用工程。 是制定與低離子性合物和新的專有導熱填料。
One Component MicroElectric Grade Epoxy — 50-3115
50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers.
技術參數/Specifications
| Electrical | |
| Dielectric Strength | 1.46E7 |
| Dielectric Constant | 5.00 to 5.10 |
| Form | Potting Compound; Gel, Paste, or Grease |
| Material | Thermoset or RTV; Epoxy |
| Features | Electronics / Semiconductors |
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