40-3915是一個新的單組分100固體填充環(huán)氧樹粘劑。 個系統(tǒng)以滿半導(dǎo)體業(yè)的嚴(yán)格求。 40-3915是多才多的可以在低溫或溫下固化單元治愈。 它不含有任何溶劑和100度后的離子雜含極低。
One Component Silver Filled Epoxy — 40-3915
40-3915 is a new single component, 100% solids, silver filled epoxy adhesive. This system was engineered to meet the stringent requirements of the semiconductor industry. 40-3915 is versatile and can be cured at low temperatures or snap cured at elevated temperatures. It does not have any solvents and contains extremely low levels of ionic impurities after 100oC.
技術(shù)參數(shù)/Specifications
| Compound Type | Electrically Conductive Compound |
| Material Form | Die Bonding Adhesives; Liquid |
| Industry | Electronics (PCB / SMT Assembly); OEM / Industrial |
| Chemical System | Epoxy |
一個組件填充環(huán)氧樹-40-3915,環(huán)氧樹等..,電氣樹和電子化合物,One Component Silver Filled Epoxy , 40-3915, Epoxies Etc…, Electrical Resins and Electronic Compounds