20-2365是一種新的低粘度氨低應力敏感元件中后治愈。 種填充氨樹體系制定用于低放熱低收縮優的電性的應用程序。 20-2365擁有便利的混合比例是理想的混合和分備。 個系統是一個包含灌封應用元件不的擇。 它可在室溫下固化或度發熱。 燃及熱傳導本產品版本20-2366 FR。
Polyurethane Potting Compound — 20-2365
20-2365 is a new low viscosity polyurethane designed for low stress on sensitive components during and after cure. This filled polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. 20-2365 has a convenient mix ratio and is ideal for meter mix and dispense equipment. This system is a good choice for potting applications containing surface mount components. It can be cured at room temperature or with mild heat. The flame retardant & thermally conductive version of this product is 20-2366 FR.
技術參數/Specifications
| Compound Type | Encapsulant, Potting Compound |
| Type / Form | Liquid |
| Cure / Technology | Room Temperature Vulcanizing or Curing; Thermoset; Two Component |
| Features | High Dielectric; Unfilled |
| Industry | Electronics |
氨灌封料-20-2365,環氧樹等。,氨粘劑及密封劑,Polyurethane Potting Compound , 20-2365, Epoxies Etc…, Polyurethane Adhesives and Sealants