Polyurethane Potting & Encapsulant — 20-2130

Polyurethane Potting & Encapsulant -- 20-2130 Epoxies Etc...

種氨系統系列是專為電子灌封??封和的應用。 它們是低粘度毒性低在流TriggerBond ?雙桶盒系統。 些彈性體系統是一個用于各種電子絕緣應用。 硬度圍從爾A凝可入80。

This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety of electronic insulating applications. The durometers range from an enterable gel to Shore A 80.

技術參數/Specifications

Compound Type Encapsulant, Potting Compound
Type / Form Liquid
Substrate Compatibility Composites; Metal; Plastic
Cure / Technology Thermoset; Two Component  
Features Filled
Industry Electronics

氨灌封及密封劑-20-2130,環氧樹等。,氨粘劑及密封劑,Polyurethane Potting & Encapsulant , 20-2130, Epoxies Etc…, Polyurethane Adhesives and Sealants


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