Single Component Thermally Conductive — 50-3130

Single Component Thermally Conductive -- 50-3130 Epoxies Etc...

50-3130是一種單組分填充環氧粘合劑。 它提供了出的著力和優的熱傳導性。 50-3130利用了提供快傳熱和優的電氣絕緣專用填料混合。 50-3130是用于粘接屬和瓷的散熱。

50-3130 is a one component, highly filled, epoxy adhesive. It provides outstanding adhesion and excellent thermal conductivity. 50-3130 utilizes a blend of proprietary fillers that provide fast heat transfer and excellent electrical insulation. 50-3130 is designed for bonding metals and ceramics for heat dissipation.

技術參數/Specifications

Electrical 
Dielectric Strength 1.77E7
Dielectric Constant 5.40
Form Adhesives; Gel, Paste, or Grease
Material Filled Resin or Composite Material; Thermoset or RTV; Epoxy
Features Electronics / Semiconductors

單組分導熱-50-3130,環氧樹等..,電氣絕緣和絕緣材料,Single Component Thermally Conductive , 50-3130, Epoxies Etc…, Electrical Insulation and Dielectric Materials


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