High precision grinding machine for grinding of non-ferrous material and semiconductor material.精度磨床用于磨削有屬材料和半導體材料。Application.應用。The MPS RC Vacuum is designed for economic grinding silicon wafer up to 8″ diameter and other semiconductor material, special hard and brittle material, e.g. SiC, sapphire.MPS RC真空是專為經濟磨硅片到8”直徑和其他半導體材料特殊的硬材料如碳化硅寶石。Characteristic.特征。Wafer grinder with vertical grinding spindle and diamond cup grinding wheel; combined motor grinding spindle 3,3 kW; high precision infeed system with two phases stepping motor and free programmable infeed speed; minimal step 1μm; rotary table speed infinitely variable between 2 and 30 rpm.垂直主和剛石砂晶圓磨床組合電機磨削主3,3千瓦精度給系統的兩段步電機和可由編程給度最小步1μm盤無級變2和30 rpm之。