Manual polishing machine for semiconductor material, geeignet für Wafer bis zu 6″ Durchmesser..半導體材料手工拋光機的R Fü晶片6“Durchmesser德..Features.特征。Three phase motor with improved true running..具有改的真實..三相電機Infinitely variable speed of the polishing plate..拋光板..無級變Vacuum system..真空系統。Centering nut enables fast exchange of polishing pad..定心母使拋光墊的快交換的..Slurry feeding..泥..Wafer centering by roller system.晶圓定心系統。Rotating polishing chucks旋拋光卡盤