丹麥tantec公司介紹
我們有超過40年的歷史,任何行業的高端表面處理產品的制造經驗。Tantec不斷為苛刻的實驗要求開發新的解決方案。
Tantec集團是一家私人控股公司,成立于1974年,是一家主要為塑料和金屬表面提高附著力而生產標準和定制的等離子體和電暈系統的公司。Tantec表面處理系統擁有全世界最多的客戶超過30個全球合作伙伴.
Tantec / S是總部位于丹麥的Lunderskov,purpose-build工廠從1989年開始,服務,研發專用機械和高質量的電子表面處理設備。
Tantec EST inc .)是北美分公司,成立于1987年,在芝加哥。
Wimsheim Tantec GmbH,在漢堡,以及生產設備銷售和服務辦事處,1995年在德國成立。
產品介紹:
Roto VAC真空等離子處理器是專為小型注塑塑料部件設計的,不用把他們放在夾具中或者其他復雜的控制工具。
獨特的鼓式設計,只需要將樣品放在里面填滿,然后儀器的旋轉會確保所有的部件表面都會被處理到。
當真空度達到1~4mbar時,真空室中電極會通過等離子體電極放電,處理周期非常短,一般為20~180秒,不同材料和配方時間不同。
該款型號操作簡便,性能可靠以及處理速度非???,處理氣體可以是氬氣和氧氣,但許多情況下由于等離子電極的巨大能量,氣氛是非必要的,roto VAC電源為HV-X系列,且有特殊設計的變壓器。
FEATURES: | |
Easy to install and use | Connect to mains power and compressed air. |
Fast treatment times | High power impact enables treatment times from 20-180 seconds, depending on material. |
Standard or customised chambers | Chamber and drum size can be designed to most applications. Many available as standard. |
Vacuum level | The plasma discharge is active from 1-4 mbar depending on application. |
Process gas | Process gasses such as oxygen and argon can be used, but in mostcases it is not necessary. |
Process control | The entire plasma process is controlled by the HV-X generator and PLC unit. All parameters are displayed through the touch panel. (Standard – Proface). |
Cost efficient surface treatment | Due to the low power and no need of special treatment gasses the unit is a very cost efficient solution for improving surface wettability and adhesion. |
Vacuum pressure plasma | Enables treatment of both conductive and non-conductive surfaces. |
Technical Specifications | RotoVAC Vacuum Plasma Treater |
Mains voltage and frequency | 230 VAC or 480 VAC 3Ph. |
Output voltage/plasma power | Max. 400 Vp/max. 2000 Watt |
Power supply | HV-X plasma generator series |
Compressed air inlet | 5–6 bar dry and clean |
Process gas | Standard: air, oxygen, argon, nitrogen on request |
Vacuum pump capacity in m³/min. | 15 to 240 m³/min., depending on size of vacuum chamber |
Vacuum level | 1–4 mbar |
Evacuation time, typical | 15-60 seconds, depending on chamber size and pump capacity |
Plasma treatment time, typical | 20–180 seconds, depending on material |
Control and connectivity | Complete with touch panel. (Standard – Proface) |
Regulation compliance | CE – RoHs – WEEE |