丹麥tantec公司介紹
我們有超過40年的歷史,任何行業的高端表面處理產品的制造經驗。Tantec不斷為苛刻的實驗要求開發新的解決方案。
Tantec集團是一家私人控股公司,成立于1974年,是一家主要為塑料和金屬表面提高附著力而生產標準和定制的等離子體和電暈系統的公司。Tantec表面處理系統擁有全世界最多的客戶超過30個全球合作伙伴.
Tantec / S是總部位于丹麥的Lunderskov,purpose-build工廠從1989年開始,服務,研發專用機械和高質量的電子表面處理設備。
Tantec EST inc .)是北美分公司,成立于1987年,在芝加哥。
Wimsheim Tantec GmbH,在漢堡,以及生產設備銷售和服務辦事處,1995年在德國成立。
產品介紹:
Syrin tec是專為PP或者PE材質的注射器管筒進行360°電暈處理的系統,一般安裝在最后一道印刷工序之前的生產線中。
通過電暈放電提高表面潤濕性以及附著能力,低表面能的基質常常會導致油墨附著力差。
要獲得最佳附著力,有必要使得基板的表面能略高于粘附材料的自由能,通過電暈處理,可得到理想的結果,syrin tec專為PP、PE等材質設計,一般用于注射器管的油墨印刷。
采用高耐用的陶瓷電極,可對針管進行統一處理,有低俗和高速的標準單元,也可根據客戶要求定制特定的印刷過程。
FEATURES: | |
Easy to install and use | Connect to mains power and compressed air. |
Fast treatment times | High power impact enables treatment times from 20-180 seconds, depending on material. |
Standard or customised chambers | Chamber and drum size can be designed to most applications. Many available as standard. |
Vacuum level | The plasma discharge is active from 1-4 mbar depending on application. |
Process gas | Process gasses such as oxygen and argon can be used, but in mostcases it is not necessary. |
Process control | The entire plasma process is controlled by the HV-X generator and PLC unit. All parameters are displayed through the touch panel. (Standard – Proface). |
Cost efficient surface treatment | Due to the low power and no need of special treatment gasses the unit is a very cost efficient solution for improving surface wettability and adhesion. |
Vacuum pressure plasma | Enables treatment of both conductive and non-conductive surfaces. |
Technical Specifications | RotoVAC Vacuum Plasma Treater |
Mains voltage and frequency | 230 VAC or 480 VAC 3Ph. |
Output voltage/plasma power | Max. 400 Vp/max. 2000 Watt |
Power supply | HV-X plasma generator series |
Compressed air inlet | 5–6 bar dry and clean |
Process gas | Standard: air, oxygen, argon, nitrogen on request |
Vacuum pump capacity in m³/min. | 15 to 240 m³/min., depending on size of vacuum chamber |
Vacuum level | 1–4 mbar |
Evacuation time, typical | 15-60 seconds, depending on chamber size and pump capacity |
Plasma treatment time, typical | 20–180 seconds, depending on material |
Control and connectivity | Complete with touch panel. (Standard – Proface) |
Regulation compliance | CE – RoHs – WEEE |