VacuLINE Vacuum Plasma Treater 在線等離子處理

丹麥tantec公司介紹

我們有超過40年的歷史,任何行業(yè)的高端表面處理產(chǎn)品的制造經(jīng)驗(yàn)。Tantec不斷為苛刻的實(shí)驗(yàn)要求開發(fā)新的解決方案。

Tantec集團(tuán)是一家私人控股公司,成立于1974年,是一家主要為塑料和金屬表面提高附著力而生產(chǎn)標(biāo)準(zhǔn)和定制的等離子體和電暈系統(tǒng)的公司。Tantec表面處理系統(tǒng)擁有全世界最多的客戶超過30個(gè)全球合作伙伴.

Tantec / S是總部位于丹麥的Lunderskov,purpose-build工廠從1989年開始,服務(wù),研發(fā)專用機(jī)械和高質(zhì)量的電子表面處理設(shè)備。

Tantec EST inc .)是北美分公司,成立于1987年,在芝加哥。

Wimsheim Tantec GmbH,在漢堡,以及生產(chǎn)設(shè)備銷售和服務(wù)辦事處,1995年在德國成立。

 

產(chǎn)品介紹:

標(biāo)準(zhǔn)和定制的真空等離子處理系統(tǒng),vacu line是專為處理各種不同的注塑零件,這臺(tái)機(jī)器是為在線生產(chǎn)設(shè)計(jì)的,不需要人工操作,具有非常快速的處理時(shí)間和為下游涂料、黏合、繪畫、印刷提供最佳的表面附著力優(yōu)化。

真空度1~4mbar,電極放電,處理周期一般為20~180s(按照不同材料和構(gòu)成),其余與tec相同。

 

 

Easy to install and use Connects to main power and compressed air.
Fast treatment times High power impact enables treatment times from 20-180 seconds depending on materials.
Standard or customised chambers Chamber size can be designed to most applications.
Process gas Process gasses such as oxygen and argon can be used, but in most cases it is not necessary.
Process control Entire plasma process is controlled by the HV-X generator and PLC unit. All parameters are displayed on the touch panel. (Standard – Proface).
Cost efficient surface treatment Due to the low power and no need of special treatment gasses, the unit is a very cost efficient solution for improving surface wettability and adhesion.
Vacuum pressure plasma Enables treatment of both conductive and non-conductive surfaces.
Works in fully automated lines Integrates easily into robot cells or existing transportation lines.

Technical Specifications

VacuLINE

Mains voltage and frequency

3 x 400 VAC + 0

Plasma power

0 – 6000 Watt

Power supply

HV-X plasma generator series

Compressed air inlet

5-6 bar dry and clean

Process gas

Standard: air. On request: Oxygen, argon and nitrogen

Vacuum pump capacity in m3/min.

15 to 240 m3/min., depending on size of vacuum chamber

Vacuum level

1-4 mbar

Evacuation time, typical

15-60 seconds, depending on chamber size and pump capacity

Plasma treatment time, typical

20-180 seconds, depending on material

Control and connectivity

Complete with touch panel. (Standard – Proface)

Regulation compliance

CE – RoHs – WEEE


發(fā)帖時(shí)間: Tantec